Application: With the rapid development of microelectronics technology, printed circuit board manufacturing to multi-layered, laminated technology, rapid development and integration capabilities to solve the vertical direction can not be completed copper-tech, cutting-edge plating requirements. For example, high aspect ratio, deep blind hole plating, PCB levels corresponding pulse plating copper come. JHD production of high purity, low impurity copper oxide, copper ions not only replenish the bath, but also to ensure the purity of the bath to maintain the stability of product quality Characteristics: Toxic, irritating, relative density (water = 1): 6.32 (powder) is insoluble in water, soluble in dilute acid introduced product advantages: 1 advanced production technology determines that the product has a high copper content, not water containing organic impurities, chloride content, low metallic impurity ion content, strong batch stability. 2 unique drying process makes the product crystallized delicate, faster dissolution and dissolution process does not produce bubbles. 3 In the application process can be directly used in production of copper added impurity does not require treatment, the level of copper plating process is cost effective guarantee the quality and stability of the relative molecular weight (Molecular weight):. 79.54 CAS No: 1317 -38-0 Appearance (Appearance): dark brown powder Blackish brown powder Packaging (Packaging): 25 kg / barrel main technical indicators (Technical specification): Test Project (Test Items) Specifications (Specifications) content (Assay%) ≧ 99.3% Chloride (Cl-) ≦ 10ppm iron (Fe) ≦ 30ppm Lead (Pb) ≦ 5ppm zinc (Zn) ≦ 30ppm of nickel (Ni) ≦ 10ppm calcium (Ca) ≦ 100ppm magnesium (Mg) ≦ 100ppm manganese (Mn) ≦ 10ppm dissolution rate (Dissolving S) ≦ 30 acid insoluble (Insoluble matter in acid) ≦ 30ppm