Application: nickel sulfamate plating is an excellent main salt, compared with other nickel plating bath obtained more resilient and lower internal stress and high hardness, especially in applications with extremely superior extension when the connector plating Sexual possess because of its own characteristics, the product has been widely used in PCB, electronics, automotive, aerospace, weapons, coinage, metallurgy, nickel screen, radio, color aluminum industry Advantages introduction: 1 internal stress low, excellent flexibility and scalability for a variety of low-stress demands of electronic components, circuit board electroplating, electroforming mold, signs and other industries. 2 bath dispersion, excellent walk performance, Electroplate more is applicable even delicate three wide current density range, the deposition speed, high plating efficiency of product introduction:. within JHD pure nickel sulfamate nickel (Ni) content of up to 180 +3.75 g / L. impurities in the product content is very low, to reduce the accumulation of the plating bath of metal impurities play an important role, because experience tells us that when the bath Cu2 + reaches 10 ~ 50ppm, Zn2 + up to 20ppm, Fe2 + up to 30 ~ when 50ppm, the stress of the coating will be high and brittle hair. widely used in the PCB as a precious metal and nickel plated base metal substrate, for often subject to heavy wear and tear of some surfaces, such as switch contacts, contacts or plug fittings, nickel as gold coating a substrate, can greatly improve the wear resistance when used as a barrier layer, can effectively prevent the diffusion of nickel and copper among other metals, so that a nickel plating resist can be used as ammonia type etching agent, so that the dummy Nickel / gold plating is often used in combination as an anti-etching the metal plating layer, and can adapt to the thermocompression bonding and brazing requirements using a nickel sulfamate plating bath having the characteristics of a high deposition rate, electroforming is applied to the various various parts of the electroforming process, typical electroforming products: mold plastic or composite parts, signs, precision electroforming reach micron laser discs and other records and the relative molecular weight (Molecular):. 250.91 CAS No :13770-89-3 Appearance (Appearance): dark green liquid (Clear, dark green, odorless liquid) Packaging (Packaging): 20 liters / barrel, 5 gallons / barrel, 30 kg / drum major technical indicators (Technical specifications): Test Project (Test items) specific level (Specific grade) electronic grade (EN grade) electronic level measured values ??(EN Measured Value) content (Ni-meter) 178.5 ~ 183.5g / L 178.5 ~ 183.5g / L 182.1g / L PH value (20-25 ℃) 4.0-5.0 3.5-5. 0 4.3 Specific Gravity (Specific gravity25 ℃) 1.530-1.600g/ml 1.500-1.600 g / ml 1.552 g / ml (20 ℃) ??iron (Fe) ≦ 5ppm ≦ 5.0 ppm 3.0ppm zinc (Zn) ≦ 5ppm ≦ 2.0ppm 0.8ppm copper (Cu) ≦ 5ppm ≦ 2.0ppm 0.3ppm lead (Pb) ≦ 5ppm ≦ 5.0ppm 3.0ppm, cobalt (Co) ≦ 20ppm ≦ 5.0ppm 0.4ppm Chromium (Cr ) ≦ 5ppm ≦ 20.0ppm 3.0ppm cadmium (Cd) ≦ 5ppm ≦ 1.0ppm 0.4ppm manganese (Mn) ≦ 5ppm ≦ 5.0ppm 0.6ppm magnesium (Mg) ≦ 20.0ppm 0.8ppm sodium (Na) ≦ 50.0ppm 39.0ppm calcium ( Ca) ≦ 20.0ppm 4.0ppm chloride (Cl-) ≦ 10.0ppm 5.0ppm ammonium (NH4 +) ≦ 150.0ppm 100ppm Sulfate (So42-) ≦ 700.0ppm 400.0ppm nickel sulfamate plating bath typical construction and operation of the bath Condition (Typical buliding and operating conditions of nickel sulfamate bath): Nickel sulfamate / Ni (NH2SO3) 2 70 ~ 120g / L (Ni ion meter) nickel chloride / NiCl2 6H2O 10 ~ 20g / L boric acid / BoricAcid 30? ~ 45g / L PH 3.5 ~ 4.5 Temperature / Temperature 50 ~ 60 ℃ cathode current density / Current Density 2 ~ 5A/dm2